INDUSTRY: DS2 DEMOS 400 MBPS BPL CHIPSET
UPLC was on hand last week in New York City as DS2 unveiled a new 400 Mbps chipset that will support access as well as in-home applications. Introducing the new chip, Jorge Blasco, CEO of DS2 explained that the current 200 Mbps chipsets will not provide enough speed to support increased demand from multi-HD applications in the home and for Access BPL system subscriber growth for utilities in the future. With the new chipsets, the application layer speeds are approximately 250 Mbps, and there are additional features such as noise immunity, 256 AES bit security, Video QoS and remote management capabilities that are built in. Plus, the 400 Mbps chip will be interoperable with existing 200 Mbps chipsets. DS2 reported that 3 million 200 Mbps chipsets have been shipped, many of which have gone to British Telecom. For more information, contact the UPLC Legal/Regulatory Department
Read: UPLC PowerLine 11-20-07
Thursday, November 29, 2007
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